12-inch FOUP omnidirectional semiconductor embodied robot, which addresses the automated handling of carriers such as wafer cassettes in the wafer manufacturing processes of semiconductors. Specifically developed for the semiconductor industry, the composite robot uses a collaborative robotic arm to handle common types of carriers in wafer manufacturing, such as FOUP, FOSB, and BOX, completing the transportation and loading/unloading of wafers.
Specifications
| Product model | LINK-OWD-SRA-C-FOUP-12 |
|---|---|
| Max. Speed | 1.5 m/s |
| Duration | 8 Hours |
| Payload | 20kg |
| Dimensions | 1146*646*1222mm |
| Rotating Radius | 625mm |
| 驱动形式 | Differential drive / omnidirectional platform as stated on official product category |
| 导航方式 | High-precision SLAM navigation |
| 通信协议 | Standard electrical interfaces and communication protocols |
